We have noted previously on this blog that technology is migrating away from 2D toward 3D, and that migration is gathering pace in the marketplace today. One of the interesting things we are seeing today is a transition away from 2D semiconductors and microprocessors to 3D. What’s the big deal, you might ask? Well, as Bernard Meyerson, IBM’s chief technical officer (CTO) observes, 3D technology offers a pathway to far more powerful computer chip technology that will continue to propel Moore’s Law forward. That is good news, indeed.
Meyerson notes that 3D stacking will allow chips to be fabricated with any number of transistors stacked on top of each other. Two chips can be stacked to double the number of transistors in the footprint of one. This process, says Meyerson, follows Moore’s Law just fine.
IBM is already implementing 3D technology in telecommunication integrated circuits (IC). The company’s fab Burlington, VT, is currently stacking chips and interconnecting them. In the near future, says Meyerson, it will be possible for IBM and others to make 3D microprocessors.
IBM already has the capability to manufacture 3D microprocessors, and the company is currently making the transition to 3D. Meyerson notes that this transition will take several years to complete. He points out that multicore chips hit the market in 2001, but it wasn’t until about 2005 that most manufacturers were shipping multicore product. Meyerson believes it will probably take three or four years for 3D microprocessors to take off as well.
The first step, he says, will probably be multichip processors, stacked together with memory chips. He points out that today about half of the dissipation in microprocessors comes from communication with external memory chips. If these chips are stacked together in 3D, communication energy cost could drop to a tenth. That is a considerable improvement over conventional 2D microprocessor technology.
Meyerson notes that 3D isn’t the right choice for all computer chip technology. It works best in situations where there is a single microprocessor with multiple memory chips on top. The technology isn’t very useful, he says, when several power-hungry microprocessors are stacked together. The chip in the middle is not able to radiate enough heat.
The investment implications of the migration to 3D technology are profound, but are far too numerous to go into on a blog post. Kris and I have many ideas on this topic. We will be publishing formal reports in the future and discussing them with clients.


The technology works with 3D-enabled projectors and is suitable for screens up to 17 feet wide, the such as NEC NC800, Christie Mirage HD, and Lightspeed Design HD DepthQ, along with a silver screen from Harkness, MDI or Stewart.